Laser engraving and Laser cutting machine use a high-powered laser to mark or scribe materials with text, images, patterns, and graduations. Some products are used to mark conductive or non-conductive metals, plastics, glass, ceramics, or composite materials. Others are designed to mark integrated circuit (IC) chips, printed circuit boards (PCB), dies or semiconductor wafers. Laser engraving and laser marking machines for medical, military, and aerospace applications is also available. Laser scribing is a high-resolution marking process where the width of scribed lines is set to a specific tolerance. Each line consists of a series of small, closely spaced holes which are produced by laser energy pulses. Laser scribing is used to produce lines and characters of different fonts on semiconductors, ceramics, glass, wood, and other material surfaces. Laser engraving, another laser marking process, is used with polymers and specialized metal alloys. Laser cutting machine purchase will welcome its new time.

Laser cutting machines are distinct from traditional mechanical cutters. Since the laser never makes physical contact with the metal, there is less opportunity for the material to become contaminated. Laser cutting machines also cut metal with higher precision than that of mechanical means.